ORA 3D-bonded with PIC in advanced hybrid 3D package
ORA: Optical Receiver ASIC (EIC) 3D-bonded with a PIC in advanced 3D hybrid package
- Wide-and-slow optical receiver that enables datacenter scale-up beyond copper
- Very low energy consumption and error rate vs. conventional (fast and narrow) optical communication link
- Provides (1) analog frontend, (2) digital backend and (3) in-receiver processor / AI accelerator
LEO-NG: Physical AI accelerator for edge applications
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Super-light physical AI edge accelerator (UAVs, drones, wearables.
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Designed for 2.5D/3D integration and advanced packaging.
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Targets milliwatt, always-on physical inference in a few-mm² footprint.
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Integrates memory (in the future, 3D bonded), video and audio capture and power management.
Specifications
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VLIW MIMD architecture
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Near-memory design, 256-element FMA and special function units
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Virtual 32b FP precision
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On-chip SRAM: 8-16 MB
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Host I/O: UCIe, PCIe
Hardware acceleration of genome analysis
Human health
- Enhancing pandemic preparedness of our society
- Fighting AMR resistance
- Providing timely solutions to aggressive infectious diseases
Detection of pathogens and organic materials in drinking water
Tracking bacterial and viral pathogen transmission in wastewater
Studying microbiome
- Farm animals
- Soil (contaminated by industrial waste)