EnICS Labs at Bar-Ilan University are developing advanced “Blue-and-White” silicon chips designed entirely in Israel to protect critical computerized systems and infrastructure from cyberattacks and hidden hardware backdoors. Representing a breakthrough in next-generation chip technology, these processors position Israel as a global leader in secure semiconductor innovation.

The explosive growth of AI has created unprecedented demand for memory and processing chips, while global shortages continue to challenge industries from cloud computing to autonomous vehicles. In response, Israel is advancing local chip design and production capabilities, with EnICS (Emerging Nanoscaled Integrated Circuits and Systems Labs) playing a central role in strengthening both technological independence and national security.

As Israel’s only academic chip design center of its scale and type, EnICS brings together leading Bar-Ilan researchers to develop chips specifically engineered to defend against malware and cyberattacks that exploit hardware vulnerabilities. Unlike imported processors, these chips are designed in Israel, reducing the risk of hidden vulnerabilities and strengthening protection for highly targeted systems and critical infrastructure. By designing every component domestically, EnICS is helping secure Israel’s technological future while advancing the country’s position as a global innovation leader in secure hardware. The chips are intended for use across sensitive sectors, including defense, energy, and other critical infrastructure requiring the highest levels of cybersecurity and reliability.

EnICS’ international standing is reinforced through collaboration with TSMC, manufacturer of roughly 70 percent of the world’s chips. Bar-Ilan University became the first university in the EMEA region granted access to TSMC’s most advanced chip-design technologies, placing EnICS at the forefront of the global semiconductor ecosystem. This partnership led to a first-of-its-kind collaboration among EnICS, Avnet Israel, and TSMC to establish a joint innovation center for next-generation chip technologies, set to open in 2026 at Avnet’s site.

Alex Fish, Vice Dean for Innovation and Industry Relations at Bar-Ilan’s Faculty of Engineering and founder of EnICS, said the center will focus on advanced chip packaging using TSMC’s cutting-edge manufacturing technologies, bringing together Israeli researchers and engineers to drive technological excellence for Israel and the global community.